thermal conductivity
FORMULATOR OF SILICONES
The TEGOSIL® HT series stands for co-compounds which can be applied in HCR and LSR formulation, as well as in potting applications.
The high filler content at low viscosity levels of this co-compound is needed to achieve a good heat transfer rate, that is more and more required for growing markets like e-mobility or power electronics.
The TEGOSIL® HT series offers the opportunity to formulate cost-efficient materials that are much lighter than formulations with commonly used fillers.
THERMAL CONDUCTIVITY AGENTS:
- TEGOSIL® HT 2000
TEGOSIL® HT 2000 is used as heat transfer base for industrial articles and consumer goods based on peroxide and addition curing rubber materials.
- TEGOSIL® HT 2100
TEGOSIL® HT 2100 is used as heat transfer base for industrial articles and consumer goods based on peroxide and addition curing rubber materials.