Search

thermal conductivity

FORMULATOR OF SILICONES


The TEGOSIL® HT series stands for co-compounds which can be applied in HCR and LSR formulation, as well as in potting applications.


Formulator

The high filler content at low viscosity levels of this co-compound is needed to achieve a good heat transfer rate, that is more and more required for growing markets like e-mobility or power electronics. 

The TEGOSIL® HT series offers the opportunity to formulate cost-efficient materials that are much lighter than formulations with commonly used fillers.

THERMAL CONDUCTIVITY AGENTS:


  • TEGOSIL® HT 2000

    TEGOSIL® HT 2000 is used as heat transfer base for industrial articles and consumer goods based on peroxide and addition curing rubber materials.

  • TEGOSIL® HT 2100

    TEGOSIL® HT 2100 is used as heat transfer base for industrial articles and consumer goods based on peroxide and addition curing rubber materials.