THERMAL CONDUCTIVITY ENHANCER

For formulator of silicones

The TEGOSIL® HT series stands for co-compounds which can be applied in HCR and LSR formulation, as well as in potting applications.

The high filler content at low viscosity levels of this co-compound is needed to achieve a good heat transfer rate, that is more and more required for growing markets like e-mobility or power electronics.

The TEGOSIL® HT series offers the opportunity to formulate cost-efficient materials that are much lighter than formulations with commonly used fillers.

THERMAL CONDUCTIVITY AGENTS: